成(cheng)都(dou)宏(hong)科(ke)(ke)電(dian)子(zi)(zi)科(ke)(ke)技(ji)有限公(gong)司關于陶瓷封裝外殼自(zi)動(dong)裝架(jia)機公(gong)開比(bi)(bi)(bi)(bi)選(xuan)(xuan)流標公(gong)告成(cheng)都(dou)宏(hong)科(ke)(ke)電(dian)子(zi)(zi)科(ke)(ke)技(ji)有限公(gong)司于2024年4月2日(ri)-4月8日(ri)發布了成(cheng)都(dou)宏(hong)科(ke)(ke)電(dian)子(zi)(zi)科(ke)(ke)技(ji)有限公(gong)司陶瓷封裝外殼自(zi)動(dong)裝架(jia)機比(bi)(bi)(bi)(bi)選(xuan)(xuan)公(gong)告,于4月8日(ri)16:30截止報(bao)名,于4月9日(ri)14:00現場組織比(bi)(bi)(bi)(bi)選(xuan)(xuan)。因本項目報(bao)名的比(bi)(bi)(bi)(bi)選(xuan)(xuan)申請人不足三(san)家,本次比(bi)(bi)(bi)(bi)選(xuan)(xuan)“流標”。特此(ci)公(gong)告!成(cheng)都(dou)宏(hong)科(ke)(ke)電(dian)子(zi)(zi)科(ke)(ke)技(ji)有限公(gong)司2024年4月12日(ri)